Curing Mechanism of Epoxy Resin: Effective Use of Hardener and Analytical Techniques
★What are the optimal conditions to achieve ideal properties such as moisture resistance and heat resistance!? ★Understand the curing mechanism and process to eliminate defects and flaws!!
Speaker Part 1: Shigeki Inatomi, Technical Advisor at Asahi Organic Chemicals Industry Co., Ltd. (Former Asahi Organic Fellow) Part 2: Masahiko Yamanaka, Group Leader, Technology Development Department, Research and Development Division, Shin Nippon Rika Co., Ltd. Part 3: Tsuneo Kobayashi, Analysis Center, Research Institute, DIC Corporation Target Audience: Engineers and researchers involved in the development and manufacturing of epoxy resins Venue: 【Tokyo, Chuo Ward】Kyouka Square 2F, High-Tech Center, Conference Room 1 1 minute walk from Exit A3 of Hachobori Station (Tokyo Metro Hibiya Line/JR Keiyo Line) 5 minutes walk from Exits A1 and A2 of Takaracho Station (Toei Asakusa Line) Date and Time: February 23, 2012 (Thursday) 11:00 AM - 4:00 PM Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: 【Early Bird Discount Price】52,500 yen (tax included, including text costs) for 2 participants from one company *Limited to Tech-Zone members who apply by February 9. Membership registration is free. *After February 9, the regular price will be 55,650 yen (tax included, including text costs) for 2 participants from one company.
- Company：AndTech
- Price：10,000 yen-100,000 yen
